Solderable Probe

montaggio Solderable

In many cases, Spring Contact Probes are not used for ICT/FCT (In-Circuit Test/Functional Circuit Test) processes, but in other applications where there is a need to solder the Probes directly to the PCB (Printed Circuit Board) or to electronic devices without the use of a receptacle.

The Solderable Probes were created to meet this need. They are made with a bead for welding at the end of the pipe. They have a hole on the side of the barrel to allow complete cleaning without leaving any processing residue inside it.

Technical data of solderable probes

Recommended minimum distance (grid-pitch)

Generally, the installation pitch of our Solderable Probe ranges from 1.91mm to 2.54mm.
We can also make them with a specific installation pitch to meet the needs of the customer.

Current rating

The current rating supported by the Solderable Probe ranges from 3A to 8A.

Typical contact resistance

Our Solderable Probes have a typical contact resistance that goes between 30mΏ and 100mΏ.

Solderable probe materials and plating

The materials used for the construction of Solderable Probe, are:

  • for the barrel: brass gold plated;
  • for the spring: music wire gold plated with an average load of less than 100 g;
  • for the plunger: BeCu gold or nickel plated;

Solderable probe head shape

Being an element used in applications other than testing, such as current transit, the commonly used Solderable Probe heads are the following.
Other types of heads are always available on request.

02 Conic head 30°
03 Flat head
04 Dome head

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Tecon srl  | P.IVA 03780900233 | REA: VR-365047 | Cap. Soc. € 60.000 i.v.

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